Beschreibung
SPECIFICATIONS
Brand Name: NoEnName_Null
Hign-concerned Chemical: None
DIY Supplies: Metalworking
Origin: Mainland China
Model Number: Heatsink Plaster
Certification: none
Specifications: 5g (single)
Melting amount: 0 (200°C/24 Hours)
Evaporation: 0.001% (200°C/24 Hours)
Thermal Conductivity: >0.671W/m-K
Impedance: <0.06
Ging Time: 3min (25°C)
Track Strength: 25Kg
Strength of Connected Buildings: 1.5map
Margin Coefficient: >5.1
Scatter Coefficient: <0.005
Shipment: Fast Shipping
Stock: Sufficient
Support Dropshipping: Support Wholesale
Support Fast Shipping: Support Retail
Type1: Chip Adhesive Glue
Type2: VGA Plaster Glue
Type3: Thermal Pads Conductive Heatsink Plaster
1/2/3PCS Thermal Paste 5g Thermal Conductive Glue Hot Adhesive Glue For Radiator Cooling Heatsink Plaster Glue For Chips
1.It has high strength and fast bonding effect, and is suitable for directly attaching various components, LEDs and heat sinks.
2.Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and , good viscosity, short drying time.
3.It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C.
4.It has short surface curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc.
5.Instructions:
1) Extrusion of the product directly during use, rubbing the surface of the adherend, and immediately covering it after use, in case of trial again
2) The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.
3) Recommended thickness: 0.1-0.5mm, the thinner the better.
4) Please use solvent to clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
6.The package is sealing and the product is covered with a vacuum bag to insulate the air and increase the storage time.
Thermal properties, strong glue adhesion.
Specifications: 5g (single)
Melting amount: 0 (200°C/24 Hours)
Evaporation: 0.001% (200°C/24 Hours)
Thermal Conductivity: >0.671W/m-K
Impedance: <0.06
Ging Time: 3min (25°C)
Track Strength: 25Kg
Strength of Connected Buildings: 1.5map
Margin Coefficient: >5.1
Scatter Coefficient: <0.005
1 x Heatsink Plaster
Pagamento e Segurança
Ihre Zahlungsinformationen werden sicher verarbeitet. Wir speichern keine Kreditkartendaten und haben keinen Zugriff auf Ihre Kreditkarteninformationen.